
A surface-mount spacer establishes a precise height above the board: once soldered, its top face becomes the datum for another board, a shield can or a heatsink. The part is located by the placement machine, so pocket geometry and coplanarity decide whether it sits flat before reflow. A standoff that is not coplanar rocks on the pad, and the joint ends up with a void on one side.
Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.
Check coplanarity against the pad area, and confirm the pocket depth in the carrier tape so the nozzle can pick from a consistent height.
| Material | SUS304 Stainless Steel |
|---|---|
| Packaging | Tape & Reel packaging |
| Standard | EIA-481, IPC J-STD-002 |
| Installation | reflow soldering (SMT placement) |
| Typical substrate | board supports and thermal contact faces |
| Key inspections | height, flatness, joint integrity |
Height and flatness are sampled optically or with a height gauge.We recommend a pilot assembly at the actual torque and mating part before locking the process parameters for volume.