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SMT Fasteners

SMT surface mount standoff supplied on tape and reel, placed

Product Center · SMT Fasteners

SMT Surface Mount Standoffs

SMT surface mount standoff supplied on tape and reel, placed and reflowed like any other SMD part.
SMT Surface Mount Standoffs
Key specifications
  • MaterialSUS304 Stainless Steel
  • Installationreflow soldering (SMT placement)
  • StandardEIA-481, IPC J-STD-002
  • Typical substrateboard supports and thermal contact faces
  • Key inspectionsheight, flatness, joint integrity

Product overviewOverview

A surface-mount spacer establishes a precise height above the board: once soldered, its top face becomes the datum for another board, a shield can or a heatsink. The part is located by the placement machine, so pocket geometry and coplanarity decide whether it sits flat before reflow. A standoff that is not coplanar rocks on the pad, and the joint ends up with a void on one side.

Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.

Key featuresFeatures

  • Coplanarity decides whether the joint forms evenly.
  • Soldered to the board to create a precise support or location height.
  • Broad top face increases contact area for support and heat transfer.
  • Multiple solder feet distribute stress and improve shear capacity.

Typical applicationsApplications

  • Board-to-board support and location
  • Shield-can support
  • Heatsink contact surfaces

Selection notesSelection

Check coplanarity against the pad area, and confirm the pocket depth in the carrier tape so the nozzle can pick from a consistent height.

Frequently asked questionsFAQ

Why does an SMT standoff sit at an angle after reflow?
Usually coplanarity or paste volume: the part rocks on the paste and surface tension pulls it to one side. Both are checked before blaming the placement program.
What matters during installation of the SMT Surface Mount Standoffs?
Follow the paste profile for the board, and keep the thread free of solder and flux during reflow Coplanarity decides whether the joint forms evenly.
Specifications
MaterialSUS304 Stainless Steel
PackagingTape & Reel packaging
StandardEIA-481, IPC J-STD-002
Installationreflow soldering (SMT placement)
Typical substrateboard supports and thermal contact faces
Key inspectionsheight, flatness, joint integrity
Manufacturing and inspection

Height and flatness are sampled optically or with a height gauge.We recommend a pilot assembly at the actual torque and mating part before locking the process parameters for volume.

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