Product Center · SMT Fasteners

PCB Solder Standoffs / Nut Columns

PCB solder standoff and nut column: a threaded column that is reflowed onto the board to give a mechanical fixing point.

Key specifications

MaterialSUS304 Stainless Steel
Installationreflow soldering (SMT placement)
StandardEIA-481 (carrier tape), IPC J-STD-002 (solderability)
Typical substratePCB board-to-board supports and shield mounting
Key inspectionscoplanarity, joint push-off, thread gauging

Request a quote Request samples

Product overviewOverview

An SMT standoff joins the board through its base pads during reflow. The thread has to survive reflow without filling with solder or flux, and the base has to wet to the pad. Thread protection during reflow and the plating on the base are the two process details that decide yield.

Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.

Key featuresFeatures

Protect the thread from solder and flux during reflow.
Reflowed with the board, creating mechanical and electrical joints in one pass.
Tape-and-reel packing suits pick-and-place on dense boards.
Coplanarity controlled to limit incomplete wetting and tilting.

Typical applicationsApplications

Server and telecom boards
Industrial motherboard supports
Power module mounting

Selection notesSelection

Confirm the thread is masked or oriented away from the paste, and check that the base plating is compatible with the paste alloy used on the line.

Frequently asked questionsFAQ

Can solder enter the thread during reflow?

It can if paste is printed too close or the part is oriented with the thread down. Thread masking and placement orientation are both part of the process specification.

What matters during installation of the PCB Solder Standoffs / Nut Columns?

Follow the paste profile for the board, and keep the thread free of solder and flux during reflow Protect the thread from solder and flux during reflow.

Specifications

Material	SUS304 Stainless Steel
Packaging	Tape & Reel packaging
Standard	EIA-481 (carrier tape), IPC J-STD-002 (solderability)
Installation	reflow soldering (SMT placement)
Typical substrate	PCB board-to-board supports and shield mounting
Key inspections	coplanarity, joint push-off, thread gauging

Manufacturing and inspection

Coplanarity is measured with a feeler gauge or laser scanner against drawing tolerance.We recommend a pilot assembly at the actual torque and mating part before locking the process parameters for volume.