SMT nut

Reflow-mounted studs that stand square to the board and provide an external thread.

Key specifications

MaterialSUS304 Stainless Steel
Installationreflow soldering (SMT placement)
StandardEIA-481, IPC J-STD-002
Typical substratePCB stacking
Key inspectionsperpendicularity, joint push-off, thread gauging

Request a quote Request samples

Product overviewOverview

The base of an SMT stud is a solderable face that forms a metallurgical bond with the board land during reflow, leaving the threaded body standing above the board. Unlike a through-board stud it occupies only surface area and does not penetrate the board, which matters on multilayer and double-sided layouts.

Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.

Key featuresFeatures

Reflow attachment without board penetration, suiting multilayer layouts.
Perpendicularity controlled for board-to-board hole alignment.
Vent feature at the base reduces voids during reflow.
SUS304 or tin-plated stainless for solderability and corrosion resistance.

Typical applicationsApplications

Industrial motherboard stacking
Telecom line cards
Power and heatsink mounting

Selection notesSelection

Keep land area at least equal to the stud cross-section; smaller lands fail in shear.

Frequently asked questionsFAQ

How do I specify the SMT nut?

Keep land area at least equal to the stud cross-section; smaller lands fail in shear. Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.

What matters during installation of the SMT nut?

Check coplanarity before placing — a tilted part lifts one side and forms an open joint that inspection may miss Reflow attachment without board penetration, suiting multilayer layouts.

Specifications

Material	SUS304 Stainless Steel
Packaging	Tape & Reel packaging
Standard	EIA-481, IPC J-STD-002
Installation	reflow soldering (SMT placement)
Typical substrate	PCB stacking
Key inspections	perpendicularity, joint push-off, thread gauging

Manufacturing and inspection

Perpendicularity is sampled by CMM or square; coplanarity by laser scanning.We recommend a pilot assembly at the actual torque and mating part before locking the process parameters for volume.