High-Precision SMT Surface Mount Nuts

High-precision SMT nut reflowed onto the board as a threaded anchor for later assembly.

Key specifications

MaterialSUS304 Stainless Steel
Installationreflow soldering (SMT placement)
StandardEIA-481 (carrier tape), IPC J-STD-002 (solderability)
Typical substratePCB board-to-board supports and shield mounting
Key inspectionscoplanarity, joint push-off, thread gauging

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Product overviewOverview

Coplanarity of the solder face is the limiting factor. The nut is a mechanical anchor, so the joint has to take both the reflow profile and the tightening torque applied later. A joint that passes inspection can still fail when a screw is driven into it, because torque loads the joint in a direction reflow never tested.

Material: SUS304 Stainless Steel. It is reflow-soldered with the rest of the SMT line.

Key featuresFeatures

Test the joint with tightening torque, not only after reflow.
Coplanarity controlled to limit incomplete wetting and tilting.
SUS304 or tin-plated stainless for solderability and corrosion resistance.
M2–M4 threads with body height set by the board spacing.

Typical applicationsApplications

Industrial motherboard supports
Power module mounting
Automotive electronic control units

Selection notesSelection

Board spacing sets the body height, but allow for washer thickness and assembly tolerance.

Frequently asked questionsFAQ

Why does an SMT nut fail when a screw is driven in?

The reflow joint was never loaded in that direction. Tightening applies torque and pull-up at the joint, so the joint is tested with a screw at the specified torque rather than inspected after reflow only.

What matters during installation of the High-Precision SMT Surface Mount Nuts?

Place it within the pad tolerance before reflow; surface tension will not pull a misplaced part back into position Test the joint with tightening torque, not only after reflow.

Specifications

Material	SUS304 Stainless Steel
Packaging	Tape & Reel packaging
Standard	EIA-481 (carrier tape), IPC J-STD-002 (solderability)
Installation	reflow soldering (SMT placement)
Typical substrate	PCB board-to-board supports and shield mounting
Key inspections	coplanarity, joint push-off, thread gauging

Manufacturing and inspection

Solderability is sampled to IPC J-STD-002, with push-off tests after reflow.Alternative materials and finishes can be quoted side by side during sampling, so cost and corrosion resistance can be traded off explicitly.