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High-Current Cold Crimp Terminal

High-current cold crimp terminal: the conductor is crimped rather than soldered, so the joint is mechanical and the board end is reflowed.

Key specifications

MaterialSUS304 Stainless Steel
Installationreflow or wave soldering
StandardEIA-481, IPC J-STD-002
Typical substratehigh-current power and ground circuits
Key inspectionscontact resistance, temperature rise, solderability

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Product overviewOverview

High-current terminals are designed around resistance and temperature rise: larger contact area and stable contact pressure lower resistance. A crimped connection relies on deformation and contact area rather than on a filler metal, which avoids the voids and IMC layer that raise resistance in a soldered joint. Crimp height and wire strand count are what the resistance actually depends on.

Material: SUS304 Stainless Steel. It is attached by reflow or by wave soldering.

Key featuresFeatures

Crimp height and strand count set the joint resistance.
Thick copper or copper-alloy body for low contact resistance.
Enlarged solder face reduces joint resistance and temperature rise.
Tin or nickel plating suppresses oxidation and stabilises contact.

Typical applicationsApplications

Motor drive power input
Battery management board connections
Charger high-current circuits

Selection notesSelection

Specify crimp height with the wire range and verify by pull test and millivolt drop rather than by visual inspection.

Frequently asked questionsFAQ

Why crimp instead of solder for high current?

A crimp avoids the voids and intermetallic layer of a soldered joint, both of which raise resistance and heat. The trade-off is that crimp height must be controlled to a narrow window.

What matters during installation of the High-Current Cold Crimp Terminal?

Attach it by reflow or by wave soldering. Crimp height and strand count set the joint resistance.

Specifications

Material	SUS304 Stainless Steel
Packaging	Tape & Reel packaging
Standard	EIA-481, IPC J-STD-002
Installation	reflow or wave soldering
Typical substrate	high-current power and ground circuits
Key inspections	contact resistance, temperature rise, solderability

Manufacturing and inspection

Contact resistance is sampled with a milliohm meter against the drawing limit.We recommend a pilot assembly at the actual torque and mating part before locking the process parameters for volume.