
Failures at high current usually start with heat. At high current the limiting factor is temperature rise at the joint, not the cross-section of the terminal. Solder voids and thin joints raise local resistance, so the pad area and paste volume are chosen to keep the joint temperature within the board rating.
Material: SUS304 Stainless Steel. It is attached by reflow or by wave soldering.
Size the pad for current, not for the footprint of the part, and verify temperature rise on the assembled board at rated current.
| Material | SUS304 Stainless Steel |
|---|---|
| Packaging | Tape & Reel packaging |
| Standard | EIA-481, IPC J-STD-002 |
| Installation | reflow or wave soldering |
| Typical substrate | high-current power and ground circuits |
| Key inspections | contact resistance, temperature rise, solderability |
Temperature-rise testing runs rated current to thermal equilibrium, recording terminal and joint temperatures.Alternative materials and finishes can be quoted side by side during sampling, so cost and corrosion resistance can be traded off explicitly.